During its Q3 FY2026 earnings call, Qualcomm confirmed that its custom ASIC chips for cloud providers have entered wafer production, with revenue recognition beginning in the December quarter. Two major hyperscaler projects are now in the manufacturing phase.

The company also disclosed that its first HBC (High-Bandwidth Compute) architecture chip has completed tape-out, with a planned market launch in mid-2027. The chip integrates near-memory accelerator units and stacked LPDDR dies via TSV, significantly boosting memory bandwidth for AI workloads.

On pricing, CEO Cristiano Amon stated that Qualcomm's double-digit chip price hikes are simply passing through higher wafer and material costs – and compared to memory content in BOM, the impact on phone pricing is limited.

Qualcomm highlighted its supply chain strength – with capacity locked across multiple process nodes and sufficient inventory buffers – offsetting tightness across foundry, packaging, and test equipment.

The 5th-gen Snapdragon Digital Chassis is set to enter mass production in September 2026. While Apple-related phone demand softens, Qualcomm is growing its automotive, IoT, and edge computing businesses to fill the revenue gap.

From ICgoodFind: Qualcomm is no longer just a phone-chip company. Cloud ASICs, HBC compute chips, and automotive are three new revenue engines now firing in parallel – and that diversification matters.