A tech media mining of Mi Code database revealed key details of Xiaomi’s next self‑developed chip – XRING O3. Codenamed “lhasa”, it will debut exclusively in China on the MIX Fold 5 (codename Q18).

Compared to the O1, the O3 features a complete architecture rework – dropping the big‑core cluster for a 3‑cluster design: Prime + Titanium + Little.

Key specs:

• Prime Core: 4.05GHz (exceeds 4GHz barrier)

• Titanium Core (performance): 3.42GHz

• Little Core (super efficiency): 3.02GHz – up from 1.79GHz on O1 (a ~68% jump)

• GPU: ~1.5GHz – up 25% from O1’s 1.2GHz

• Memory: stays at 9600 MT/s for top bandwidth without extra power

The ultra‑high frequency little cores boost background task management and multitasking – perfect for foldable productivity. Estimated price: ~$1,500.

Possible cluster combos: 1+3+4 or 1+2+5 – but Xiaomi may try non‑traditional setups.

ICgoodFind: XRING O3 pushes 4GHz with a brave new cluster design – Xiaomi’s in‑house chip ambition grows.