Infineon FZ2400R17HP4: A 1700V IHV Module for Demanding Industrial Applications
The relentless drive for higher efficiency, greater power density, and enhanced reliability in industrial systems has pushed power semiconductor technology to new frontiers. At the forefront of this evolution is Infineon Technologies with its FZ2400R17HP4, a high-power IHV (Industrial High Voltage) module engineered to excel in the most demanding applications. This module represents a significant leap forward, offering system designers a robust and highly integrated solution for high-power conversion.
Engineered for Extreme Performance
The FZ2400R17HP4 is built around a 1700V rated IGBT7 chipset, the latest generation of Infineon's field-stop trench-gate technology. This advanced chip technology is the cornerstone of the module's exceptional performance, delivering an optimal balance between low saturation voltage (VCE(sat)) and minimal switching losses. This translates directly into higher overall system efficiency and reduced operating temperatures, which are critical for energy-intensive processes.
With a nominal current rating of 2400A, this module is designed to handle very high power levels. It is particularly suited for high-power industrial drives, heavy-duty traction applications, and large-scale industrial power supplies and inverters. Its high voltage capability makes it an ideal choice for systems operating directly from stiff DC links, commonly found in applications like mining equipment, rolling mills, and medium-voltage drive systems.
Robustness and Reliability Built-In
Demanding industrial environments are characterized by wide temperature fluctuations, mechanical stress, and electrical transients. The FZ2400R17HP4 is designed to withstand these challenges. Key features that ensure operational integrity include:
Low thermal resistance and high power cycling capability, enabled by an advanced baseplate and bonding technologies, ensuring a long service life even under strenuous thermal cycling conditions.
An integrated NTC thermistor for accurate temperature monitoring, allowing for proactive thermal management and system protection.
High short-circuit ruggedness (SCSOA), providing critical survival time for the control circuitry to react and shut down the system safely in fault conditions, thereby protecting both the module and the entire system.
The module's mechanical design is equally robust, featuring a press-fit interface for low-inductance and reliable DCB (Direct Copper Bonding) connections, which simplifies assembly and enhances power cycling performance.
Driving System-Level Advantages
By integrating such a high-current and high-voltage device into a single module, Infineon provides system architects with a compact and simplified solution. This high level of integration reduces the part count, minimizes parasitic inductance in the commutation loop, and streamlines the design of busbars and cooling systems. The result is a reduction in system size, weight, and ultimately, total cost of ownership for end-users.
ICGOOODFIND
The Infineon FZ2400R17HP4 is a pinnacle of high-power semiconductor design, leveraging the state-of-the-art IGBT7 technology to set a new benchmark for performance and reliability in 1700V applications. It is not merely a component but a comprehensive solution that empowers engineers to build more efficient, compact, and robust systems for the world's most challenging industrial environments.
Keywords:
1. 1700V IHV Module
2. IGBT7 Technology
3. High Power Density
4. Thermal Robustness
5. Industrial Drives
